MCF5272CVF66
vs
GD80960JD-50
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
INTEL CORP
Part Package Code
BGA
BGA
Package Description
BGA, BGA196,14X14,40
PLASTIC, BGA-196
Pin Count
196
196
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Address Bus Width
23
32
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
66 MHz
25 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B196
S-PBGA-B196
Length
15 mm
Low Power Mode
YES
YES
Number of Terminals
196
196
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA196,14X14,40
BGA196(UNSPEC)
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Speed
66 MHz
50 MHz
Supply Voltage-Max
3.6 V
3.45 V
Supply Voltage-Min
3 V
3.15 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
15 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
5
1
Additional Feature
BURST BUS
Power Supplies
3.3,3.3/5 V
Supply Current-Max
447 mA
Compare MCF5272CVF66 with alternatives
Compare GD80960JD-50 with alternatives