MCF5251VM140
vs
MC9328MXLDVP15R2
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
LEAD FREE, MAPBGA-225
13 X 13 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-225
Reach Compliance Code
compliant
compliant
Factory Lead Time
13 Weeks
Address Bus Width
24
25
Bit Size
32
32
Boundary Scan
YES
YES
Clock Frequency-Max
140 MHz
16 MHz
External Data Bus Width
32
32
Format
FIXED POINT
FIXED POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B225
S-PBGA-B225
Length
13 mm
13 mm
Low Power Mode
NO
YES
Moisture Sensitivity Level
3
3
Number of Terminals
225
225
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA225,15X15,32
BGA225,15X15,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Speed
140 MHz
150 MHz
Supply Voltage-Max
1.32 V
1.9 V
Supply Voltage-Min
1.08 V
1.7 V
Supply Voltage-Nom
1.2 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
40
40
Width
13 mm
13 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Pin Count
225
HTS Code
8542.31.00.01
Additional Feature
ALSO REQUIRES 3.3V SUPPLY
Terminal Finish
TIN SILVER COPPER OVER NICKEL
Compare MCF5251VM140 with alternatives
Compare MC9328MXLDVP15R2 with alternatives