MC9328MXLDVP15R2
vs
KMC9328MXLVF15
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
MAPBGA-225
LFBGA,
Reach Compliance Code
unknown
unknown
Factory Lead Time
4 Weeks
JESD-30 Code
S-PBGA-B225
S-PBGA-B225
Length
13 mm
13 mm
Number of Terminals
225
225
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
-30 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA225,15X15,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max
1.9 V
1.9 V
Supply Voltage-Min
1.7 V
1.7 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
uPs/uCs/Peripheral ICs Type
SoC
MICROPROCESSOR, RISC
Base Number Matches
2
3
Part Package Code
BGA
Pin Count
225
HTS Code
8542.31.00.01
Address Bus Width
25
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
16 MHz
External Data Bus Width
32
Format
FIXED POINT
Integrated Cache
YES
Low Power Mode
YES
Qualification Status
Not Qualified
Speed
150 MHz
Temperature Grade
COMMERCIAL
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