MC9S12XEP100CAL
vs
MC9S12XEP100CALR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
LQFP-112
LQFP-112
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
12 Weeks
Samacsys Manufacturer
NXP
Has ADC
YES
YES
Additional Feature
IT ALSO REQUIRES 5 V I/O SUPPLY
IT ALSO REQUIRES 5 V I/O SUPPLY
Address Bus Width
23
23
Bit Size
32
32
Boundary Scan
NO
CPU Family
CPU12
CPU12
Clock Frequency-Max
40 MHz
40 MHz
DAC Channels
NO
NO
DMA Channels
NO
YES
External Data Bus Width
16
16
JESD-30 Code
S-PQFP-G112
S-PQFP-G112
JESD-609 Code
e3
e3
Length
20 mm
20 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
91
91
Number of Terminals
112
112
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP112,.87SQ
QFP112,.87SQ
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
65536
65536
ROM (words)
1048576
1048576
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
50 MHz
50 MHz
Supply Voltage-Max
1.98 V
1.98 V
Supply Voltage-Min
1.72 V
1.72 V
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
20 mm
20 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
2
Part Package Code
QFP
Pin Count
112
Compare MC9S12XEP100CAL with alternatives
Compare MC9S12XEP100CALR with alternatives