MC9S12XEP100CALR vs MC9S12XEP100VAGR feature comparison

MC9S12XEP100CALR Freescale Semiconductor

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MC9S12XEP100VAGR NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC NXP SEMICONDUCTORS
Part Package Code QFP
Package Description LQFP-112 LQFP-144
Pin Count 112
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature IT ALSO REQUIRES 5 V I/O SUPPLY IT ALSO REQUIRES 5 V I/O SUPPLY
Address Bus Width 23 23
Bit Size 32 32
CPU Family CPU12 CPU12
Clock Frequency-Max 40 MHz 40 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G112 S-PQFP-G144
JESD-609 Code e3
Length 20 mm 20 mm
Moisture Sensitivity Level 3
Number of I/O Lines 91 119
Number of Terminals 112 144
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LFQFP
Package Equivalence Code QFP112,.87SQ QFP144,.87SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 65536 65536
ROM (words) 1048576 1048576
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 1.98 V 1.98 V
Supply Voltage-Min 1.72 V 1.8 V
Supply Voltage-Nom 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 20 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 2

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