MC9S12XEP100CAL
vs
MC9S12XEP100VVLR
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
FREESCALE SEMICONDUCTOR INC
|
Package Description |
LQFP-112
|
BGA, BGA208,16X16,40
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
4 Weeks
|
|
Samacsys Manufacturer |
NXP
|
|
Has ADC |
YES
|
YES
|
Additional Feature |
IT ALSO REQUIRES 5 V I/O SUPPLY
|
IT ALSO REQUIRES 5 V I/O SUPPLY
|
Address Bus Width |
23
|
23
|
Bit Size |
32
|
32
|
Boundary Scan |
NO
|
|
CPU Family |
CPU12
|
CPU12
|
Clock Frequency-Max |
40 MHz
|
40 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
YES
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G112
|
S-PBGA-B208
|
JESD-609 Code |
e3
|
|
Length |
20 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
91
|
152
|
Number of Terminals |
112
|
208
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
BGA
|
Package Equivalence Code |
QFP112,.87SQ
|
BGA208,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
65536
|
65536
|
ROM (words) |
1048576
|
1048576
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
2 mm
|
Speed |
50 MHz
|
50 MHz
|
Supply Voltage-Max |
1.98 V
|
1.98 V
|
Supply Voltage-Min |
1.72 V
|
1.8 V
|
Supply Voltage-Nom |
1.8 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.65 mm
|
1 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
20 mm
|
17 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
208
|
|
|
|
Compare MC9S12XEP100CAL with alternatives
Compare MC9S12XEP100VVLR with alternatives