MC9S12C32VPBE16 vs MC9S12C128CPBE25 feature comparison

MC9S12C32VPBE16 NXP Semiconductors

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MC9S12C128CPBE25 NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description LQFP-52 PLASTIC, LQFP-52
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width 16 16
Bit Size 16 16
Clock Frequency-Max 50 MHz 50 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G52 S-PQFP-G52
JESD-609 Code e3
Length 10 mm 10 mm
Moisture Sensitivity Level 3
Number of I/O Lines 35 35
Number of Terminals 52 52
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 260
ROM Programmability FLASH FLASH
Seated Height-Max 1.7 mm 1.7 mm
Speed 16 MHz 25 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.35 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Additional Feature ALSO REQUIRES 5V SUPPLY
Boundary Scan NO
On Chip Program ROM Width 8
Qualification Status Not Qualified
ROM (words) 131072

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