MC9S12C128CPBE25 vs MC9S12C32VPBE16 feature comparison

MC9S12C128CPBE25 NXP Semiconductors

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MC9S12C32VPBE16 NXP Semiconductors

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Part Life Cycle Code Active Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description PLASTIC, LQFP-52 LQFP-52
Reach Compliance Code unknown compliant
ECCN Code 3A991.A.2 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO REQUIRES 5V SUPPLY
Address Bus Width 16 16
Bit Size 16 16
Boundary Scan NO
Clock Frequency-Max 50 MHz 50 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G52 S-PQFP-G52
Length 10 mm 10 mm
Number of I/O Lines 35 35
Number of Terminals 52 52
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Qualification Status Not Qualified
ROM (words) 131072
ROM Programmability FLASH FLASH
Seated Height-Max 1.7 mm 1.7 mm
Speed 25 MHz 16 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.35 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code Yes
Factory Lead Time 13 Weeks
Samacsys Manufacturer NXP
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) 40

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