MC9S08SH8CTJR
vs
MC9S08SH8CFK
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
0.65 MM PITCH, TSSOP-20
4 X 4 MM, 1 MM HEIGHT, MO-220VGGD-6, QFN-24
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
EAR99
HTS Code
8542.31.00.01
8542.31.00.01
Factory Lead Time
13 Weeks
13 Weeks
Samacsys Manufacturer
NXP
NXP
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G20
S-PQCC-N24
JESD-609 Code
e3
Length
6.5 mm
4 mm
Moisture Sensitivity Level
3
3
Number of I/O Lines
18
18
Number of Terminals
20
24
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
HVQCCN
Package Equivalence Code
TSSOP20,.25
LCC24,.16SQ,20
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
512
512
ROM (words)
8192
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
1 mm
Speed
40 MHz
40 MHz
Supply Current-Max
7.7 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin (Sn)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
40
40
Width
4.4 mm
4 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
2
Compare MC9S08SH8CTJR with alternatives
Compare MC9S08SH8CFK with alternatives