MC9S08RC16CFJE
vs
MC9S08RC16FJ
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
,
7 X 7 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, MS-026BBA, LQFP-32
Reach Compliance Code
unknown
not_compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
NO
NO
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
NO
CPU Family
HCS08
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQFP-G32
S-PQFP-G32
Length
7 mm
7 mm
Low Power Mode
YES
Number of External Interrupts
1
Number of I/O Lines
27
27
Number of Serial I/Os
1
Number of Terminals
32
32
Number of Timers
3
On Chip Data RAM Width
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP32,.35SQ,32
QFP32,.35SQ,32
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel)
260
240
RAM (bytes)
1024
1024
ROM (words)
16384
16384
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
1.6 mm
Speed
8 MHz
8 MHz
Supply Current-Max
4.8 mA
4.8 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
2 V
Supply Voltage-Nom
3 V
2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
30
Width
7 mm
7 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
1
2
Rohs Code
No
Part Package Code
QFP
Pin Count
32
ECCN Code
EAR99
JESD-609 Code
e0
Moisture Sensitivity Level
3
Qualification Status
Not Qualified
Temperature Grade
COMMERCIAL
Terminal Finish
TIN LEAD
Compare MC9S08RC16CFJE with alternatives
Compare MC9S08RC16FJ with alternatives