MC75172BDW vs AM26LS32AMJ883B feature comparison

MC75172BDW onsemi

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AM26LS32AMJ883B Texas Instruments

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Pbfree Code No
Part Life Cycle Code Contact Manufacturer Obsolete
Ihs Manufacturer ON SEMICONDUCTOR TEXAS INSTRUMENTS INC
Part Package Code SOIC-20 WB DIP
Package Description SOP, SOP20,.4 DIP,
Pin Count 20 16
Manufacturer Package Code 751D-05
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer onsemi
Differential Output YES
Driver Number of Bits 4
High Level Input Current-Max 0.00002 A
Input Characteristics STANDARD DIFFERENTIAL SCHMITT TRIGGER
Interface IC Type LINE DRIVER LINE RECEIVER
Interface Standard V.11; X.27; EIA-422-A; EIA-485 EIA-422-B; TIA-422-B; EIA-423-B; TIA-423-B; V.10; V.11
JESD-30 Code R-PDSO-G20 R-GDIP-T16
JESD-609 Code e0
Length 12.8 mm
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Terminals 20 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Out Swing-Min 1.5 V
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Receive Delay-Max 35 ns
Seated Height-Max 2.65 mm 5.08 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Transmit Delay-Max 25 ns
Width 7.5 mm 7.62 mm
Base Number Matches 4 1
Receiver Number of Bits 4
Screening Level MIL-STD-883 Class B

Compare MC75172BDW with alternatives

Compare AM26LS32AMJ883B with alternatives