MC74LCX158MR2
vs
74LVC1G157GW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOT-363
Package Description
SOP,
PLASTIC, SOT-363, SC-88, 6 PIN
Pin Count
16
6
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G16
R-PDSO-G6
Length
10.2 mm
2 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
1
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
6
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.05 mm
1.1 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
2.7 V
1.65 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Width
5.275 mm
1.25 mm
Base Number Matches
2
3
Pbfree Code
Rohs Code
Samacsys Manufacturer
NXP
JESD-609 Code
e3
Moisture Sensitivity Level
1
Package Equivalence Code
TSSOP6,.08
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
13 ns
Supply Voltage-Nom (Vsup)
3.3 V
Terminal Finish
Tin (Sn)
Time@Peak Reflow Temperature-Max (s)
30
Compare MC74LCX158MR2 with alternatives
Compare 74LVC1G157GW with alternatives