MC74F00D vs N74F3037D-T feature comparison

MC74F00D Motorola Mobility LLC

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N74F3037D-T NXP Semiconductors

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDSO-G14 R-PDSO-G16
JESD-609 Code e0 e4
Length 8.65 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Power Supply Current-Max (ICC) 10.2 mA 40 mA
Propagation Delay (tpd) 5.3 ns 5.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 2.65 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.5 mm
Base Number Matches 4 1
Additional Feature IOL = 160MA @ VOL = 0.5V; IOH = 67MA @ VOH = 2V; DUAL CENTER PIN VCC AND GND
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare N74F3037D-T with alternatives