MC7448HX867NC vs PPC7448HX867ND feature comparison

MC7448HX867NC Freescale Semiconductor

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PPC7448HX867ND Freescale Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 BGA,
Pin Count 360 360
Reach Compliance Code not_compliant unknown
ECCN Code 3A991 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Additional Feature LOW POWER TAKEN FROM SLEEP MODE
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 867 MHz 867 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-B360 S-CBGA-B360
JESD-609 Code e0
Length 25 mm 25 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1
Number of Terminals 360 360
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Equivalence Code BGA360,19X19,50
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Speed 867 MHz 867 MHz
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1

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