PPC7448HX867ND
vs
MC7448HX867ND
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
FREESCALE SEMICONDUCTOR INC
Package Description
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
Reach Compliance Code
unknown
not_compliant
ECCN Code
3A991.A.2
3A991
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
Bit Size
32
32
Boundary Scan
NO
NO
Clock Frequency-Max
867 MHz
867 MHz
External Data Bus Width
Format
FIXED POINT
FIXED POINT
Integrated Cache
NO
NO
JESD-30 Code
S-CBGA-B360
S-CBGA-B360
Length
25 mm
25 mm
Low Power Mode
YES
YES
Number of Terminals
360
360
Operating Temperature-Max
105 °C
105 °C
Operating Temperature-Min
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
BGA
BGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.8 mm
2.8 mm
Speed
867 MHz
867 MHz
Supply Voltage-Max
1.05 V
1.05 V
Supply Voltage-Min
0.95 V
0.95 V
Supply Voltage-Nom
1 V
1 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
BOTTOM
BOTTOM
Width
25 mm
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
MICROPROCESSOR, RISC
Base Number Matches
2
1
Rohs Code
Part Package Code
BGA
Pin Count
360
JESD-609 Code
e0
Moisture Sensitivity Level
1
Package Equivalence Code
BGA360,19X19,50
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
40
Compare PPC7448HX867ND with alternatives
Compare MC7448HX867ND with alternatives