PPC7448HX867ND vs MC7448HX867ND feature comparison

PPC7448HX867ND NXP Semiconductors

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MC7448HX867ND Freescale Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360
Reach Compliance Code unknown not_compliant
ECCN Code 3A991.A.2 3A991
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 867 MHz 867 MHz
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code S-CBGA-B360 S-CBGA-B360
Length 25 mm 25 mm
Low Power Mode YES YES
Number of Terminals 360 360
Operating Temperature-Max 105 °C 105 °C
Operating Temperature-Min
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code BGA BGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.8 mm 2.8 mm
Speed 867 MHz 867 MHz
Supply Voltage-Max 1.05 V 1.05 V
Supply Voltage-Min 0.95 V 0.95 V
Supply Voltage-Nom 1 V 1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Width 25 mm 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Rohs Code No
Part Package Code BGA
Pin Count 360
Samacsys Manufacturer NXP
JESD-609 Code e0
Moisture Sensitivity Level 1
Package Equivalence Code BGA360,19X19,50
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s) 40

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Compare MC7448HX867ND with alternatives