MC68HC11E1VFNE3
vs
MC68HC11E20FN3
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
LCC-52
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.31.00.01
|
|
| Samacsys Manufacturer |
NXP
|
|
| Has ADC |
YES
|
|
| Additional Feature |
SEATED HEIGHT CALCULATED
|
|
| Address Bus Width |
16
|
|
| Bit Size |
8
|
|
| Clock Frequency-Max |
12 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| External Data Bus Width |
8
|
|
| JESD-30 Code |
S-PQCC-J52
|
|
| JESD-609 Code |
e3
|
|
| Length |
19.125 mm
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of I/O Lines |
38
|
|
| Number of Terminals |
52
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
NO
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QCCJ
|
|
| Package Shape |
SQUARE
|
|
| Package Style |
CHIP CARRIER
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| RAM (bytes) |
512
|
|
| ROM (words) |
0
|
|
| Seated Height-Max |
5.08 mm
|
|
| Speed |
3 MHz
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
4.5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
HCMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
J BEND
|
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
19.125 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
5
|
|
|
|
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