MC68HC11E1VFNE3 vs MC68HC11E1MFN2 feature comparison

MC68HC11E1VFNE3 NXP Semiconductors

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MC68HC11E1MFN2 Motorola Semiconductor Products

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Package Description LCC-52 PLASTIC, LCC-52
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 52 Weeks
Date Of Intro 1988-01-01
Samacsys Manufacturer NXP
Has ADC YES YES
Additional Feature SEATED HEIGHT CALCULATED
Address Bus Width 16 16
Bit Size 8 8
Boundary Scan NO
Clock Frequency-Max 12 MHz 8 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code S-PQCC-J52 S-PQCC-J52
JESD-609 Code e3 e0
Length 19.125 mm 19.125 mm
Moisture Sensitivity Level 3
Number of I/O Lines 38 38
Number of Terminals 52 52
Operating Temperature-Max 105 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO NO
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QCCJ QCCJ
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER CHIP CARRIER
Peak Reflow Temperature (Cel) 260
ROM Programmability ROM LESS EEPROM
Seated Height-Max 5.08 mm 4.57 mm
Speed 3 MHz 2 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 4.5 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology HCMOS HCMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Tin (Sn) Tin/Lead (Sn/Pb)
Terminal Form J BEND J BEND
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 19.125 mm 19.125 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 5
CPU Family 6800
On Chip Program ROM Width 8
Package Equivalence Code LDCC52,.8SQ
Qualification Status Not Qualified
RAM (bytes) 512
ROM (words) 512
Supply Current-Max 27 mA

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