MC68HC11E1VFNE3
vs
MC68HC11E1VFN3
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
Package Description |
LCC-52
|
QCCJ,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
52 Weeks
|
|
Date Of Intro |
1988-01-01
|
|
Samacsys Manufacturer |
NXP
|
|
Has ADC |
YES
|
YES
|
Additional Feature |
SEATED HEIGHT CALCULATED
|
|
Address Bus Width |
16
|
16
|
Bit Size |
8
|
8
|
Boundary Scan |
NO
|
|
Clock Frequency-Max |
12 MHz
|
12 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
8
|
8
|
JESD-30 Code |
S-PQCC-J52
|
S-PQCC-J52
|
JESD-609 Code |
e3
|
|
Length |
19.125 mm
|
19.125 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
38
|
38
|
Number of Terminals |
52
|
52
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
ROM Programmability |
ROM LESS
|
|
Seated Height-Max |
5.08 mm
|
4.57 mm
|
Speed |
3 MHz
|
3 MHz
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
19.125 mm
|
19.125 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
4
|
Part Package Code |
|
LCC
|
Pin Count |
|
52
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare MC68HC11E1VFNE3 with alternatives
Compare MC68HC11E1VFN3 with alternatives