MC68882FN25
vs
TS68882MR1B/C25
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
TELEDYNE E2V (UK) LTD
Part Package Code
LCC
PGA
Package Description
QCCJ,
PGA, PGA68,10X10
Pin Count
68
68
Reach Compliance Code
unknown
unknown
HTS Code
8542.31.00.01
Address Bus Width
5
5
Barrel Shifter
YES
YES
Boundary Scan
NO
NO
Bus Compatibility
MC68020; MC68030
Clock Frequency-Max
25 MHz
25 MHz
External Data Bus Width
32
32
JESD-30 Code
S-PQCC-J68
S-CPGA-P68
JESD-609 Code
e0
Length
24.2062 mm
26.92 mm
Number of Terminals
68
68
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
PGA
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.82 mm
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
PIN/PEG
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
PERPENDICULAR
Width
24.2062 mm
26.92 mm
uPs/uCs/Peripheral ICs Type
MATH PROCESSOR, COPROCESSOR
MATH PROCESSOR, COPROCESSOR
Base Number Matches
3
2
Rohs Code
Package Equivalence Code
PGA68,10X10
Screening Level
MIL-STD-883 Class B; MIL-PRF-38535
Supply Current-Max
136 mA
Compare MC68882FN25 with alternatives
Compare TS68882MR1B/C25 with alternatives