MC68440R-10
vs
SAB82257-N
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
SIEMENS A G
|
Part Package Code |
PGA
|
|
Package Description |
PGA,
|
,
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
24
|
24
|
Bus Compatibility |
M68000
|
8086; 8088; 80186; 80188; 80286
|
Clock Frequency-Max |
10 MHz
|
8 MHz
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-CPGA-P68
|
S-PQCC-J68
|
JESD-609 Code |
e0
|
|
Length |
26.92 mm
|
|
Number of DMA Channels |
2
|
4
|
Number of Terminals |
68
|
68
|
Operating Temperature-Max |
70 °C
|
100 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
PGA
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.59 mm
|
|
Supply Voltage-Max |
5.25 V
|
5.5 V
|
Supply Voltage-Min |
4.75 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
MOS
|
NMOS
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
PIN/PEG
|
J BEND
|
Terminal Pitch |
2.54 mm
|
|
Terminal Position |
PERPENDICULAR
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
26.92 mm
|
|
uPs/uCs/Peripheral ICs Type |
DMA CONTROLLER
|
DMA CONTROLLER
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MC68440R-10 with alternatives
Compare SAB82257-N with alternatives