MC33385DHR2
vs
MC33385DHR2
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
MOTOROLA INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
PLASTIC, HSOP-20
|
HSOP,
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
compliant
|
unknown
|
| Built-in Protections |
TRANSIENT; UNDER VOLTAGE
|
OVER CURRENT; THERMAL; UNDER VOLTAGE
|
| Driver Number of Bits |
4
|
|
| Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
15.9 mm
|
15.9 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current Flow Direction |
SINK
|
SINK
|
| Output Current-Max |
2.5 A
|
|
| Output Peak Current Limit-Nom |
5 A
|
10 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HSOP
|
HSOP
|
| Package Equivalence Code |
SOP20,.56
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG
|
SMALL OUTLINE, HEAT SINK/SLUG
|
| Peak Reflow Temperature (Cel) |
220
|
|
| Power Supplies |
5 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.4 mm
|
3.35 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Turn-off Time |
7.5 µs
|
5 µs
|
| Turn-on Time |
5 µs
|
7.5 µs
|
| Width |
11 mm
|
11 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MC33385DHR2 with alternatives
Compare MC33385DHR2 with alternatives