MC33091ADR2
vs
MC33091AP
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
DIP, DIP8,.3
|
| Pin Count |
8
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| High Side Driver |
YES
|
YES
|
| Interface IC Type |
BUFFER OR INVERTER BASED MOSFET DRIVER
|
BUFFER OR INVERTER BASED MOSFET DRIVER
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDIP-T8
|
| Length |
4.9 mm
|
9.78 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.75 mm
|
4.45 mm
|
| Supply Voltage-Max |
24 V
|
24 V
|
| Supply Voltage-Min |
7 V
|
7 V
|
| Supply Voltage-Nom |
14 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| Input Characteristics |
|
STANDARD
|
| Output Characteristics |
|
OPEN-COLLECTOR
|
| Package Equivalence Code |
|
DIP8,.3
|
| Supply Current-Max |
|
6 mA
|
|
|
|
Compare MC33091ADR2 with alternatives
Compare MC33091AP with alternatives