MC145026P
vs
TEA5500
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP16,.3
|
DIP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
TRANSMITTER IC
|
SUPPORT CIRCUIT
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e0
|
|
| Length |
19.175 mm
|
21.68 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
80 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
4.7 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
6.5 V
|
| Supply Voltage-Min (Vsup) |
2.5 V
|
3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Samacsys Manufacturer |
|
NXP
|
| Transmission Media |
|
INFRARED
|
|
|
|
Compare MC145026P with alternatives
Compare TEA5500 with alternatives