MC1413BPG
vs
MC1413DR2G
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
SOIC
Package Description
LEAD FREE, PLASTIC, CASE 648-08, DIP-16
LEAD FREE, CASE 751B-05, SOIC-16
Pin Count
16
16
Manufacturer Package Code
CASE 648-08
CASE 751B-05
Reach Compliance Code
unknown
unknown
Additional Feature
LOGIC LEVEL COMPATIBLE
LOGIC LEVEL COMPATIBLE
Collector Current-Max (IC)
0.5 A
0.5 A
Collector-Emitter Voltage-Max
50 V
50 V
Configuration
COMPLEX
COMPLEX
DC Current Gain-Min (hFE)
1000
1000
JESD-30 Code
R-PDIP-T16
R-PDSO-G16
JESD-609 Code
e3
e3
Moisture Sensitivity Level
NOT SPECIFIED
NOT SPECIFIED
Number of Elements
7
7
Number of Terminals
16
16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Polarity/Channel Type
NPN
NPN
Qualification Status
COMMERCIAL
COMMERCIAL
Surface Mount
NO
YES
Terminal Finish
MATTE TIN
MATTE TIN
Terminal Form
THROUGH-HOLE
GULL WING
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
40
40
Transistor Application
SWITCHING
SWITCHING
Transistor Element Material
SILICON
SILICON
Base Number Matches
2
2
Compare MC1413BPG with alternatives
Compare MC1413DR2G with alternatives