MC14076BD
vs
MC14076BCPG
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
ONSEMI
Part Package Code
SOIC
DIP
Package Description
PLASTIC, SOIC-16
LEAD FREE, PLASTIC, DIP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e0
e3
Length
9.9 mm
19.175 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
600 ns
600 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.44 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin (Sn)
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
7.62 mm
fmax-Min
6 MHz
6 MHz
Base Number Matches
5
1
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
Load Capacitance (CL)
50 pF
Max Frequency@Nom-Sup
1800000 Hz
Package Equivalence Code
DIP16,.3
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Technology
CMOS
Time@Peak Reflow Temperature-Max (s)
40
Compare MC14076BD with alternatives
Compare MC14076BCPG with alternatives