MC14076BD
vs
MC14076BCLD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
MOTOROLA INC
Part Package Code
SOIC
DIP
Package Description
PLASTIC, SOIC-16
DIP, DIP16,.3
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G16
R-GDIP-T16
JESD-609 Code
e0
e0
Length
9.9 mm
19.3 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
4
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
600 ns
600 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
4.19 mm
Supply Voltage-Max (Vsup)
18 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
3.9 mm
7.62 mm
fmax-Min
6 MHz
1.8 MHz
Base Number Matches
5
3
Additional Feature
WITH HOLD MODE
Load Capacitance (CL)
50 pF
Package Equivalence Code
DIP16,.3
Technology
CMOS
Compare MC14076BD with alternatives
Compare MC14076BCLD with alternatives