MC14067BCPD
vs
933324250652
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP, DIP24,.6
DIP,
Pin Count
24
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
R-PDIP-T24
R-PDIP-T24
JESD-609 Code
e0
e3
Length
31.75 mm
31.7 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels
16
16
Number of Functions
1
1
Number of Terminals
24
24
Off-state Isolation-Nom
40 dB
50 dB
On-state Resistance Match-Nom
10 Ω
5 Ω
On-state Resistance-Max (Ron)
280 Ω
175 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.1 mm
Supply Current-Max (Isup)
0.6 mA
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
190 ns
340 ns
Switch-on Time-Max
190 ns
100 ns
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Tin (Sn)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
3
1
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MC14067BCPD with alternatives
Compare 933324250652 with alternatives