MC14067BCL
vs
HEF4067BPB
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA INC
NXP SEMICONDUCTORS
Part Package Code
DIP
Package Description
DIP, DIP24,.6
DIP,
Pin Count
24
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SINGLE-ENDED MULTIPLEXER
SINGLE-ENDED MULTIPLEXER
JESD-30 Code
R-CDIP-T24
R-PDIP-T24
JESD-609 Code
e0
Length
32.005 mm
31.7 mm
Neg Supply Voltage-Nom (Vsup)
Number of Channels
16
16
Number of Functions
1
1
Number of Terminals
24
24
Off-state Isolation-Nom
40 dB
50 dB
On-state Resistance Match-Nom
10 Ω
5 Ω
On-state Resistance-Max (Ron)
280 Ω
175 Ω
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, METAL-SEALED COFIRED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.6
DIP24,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.59 mm
5.1 mm
Signal Current-Max
0.025 A
Supply Current-Max (Isup)
0.6 mA
0.6 mA
Supply Voltage-Nom (Vsup)
15 V
15 V
Surface Mount
NO
NO
Switch-off Time-Max
190 ns
340 ns
Switch-on Time-Max
190 ns
100 ns
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare MC14067BCL with alternatives
Compare HEF4067BPB with alternatives