MC14050BFL2
vs
HD14050BFP
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Contact Manufacturer
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP16,.3
|
SOP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
|
Length |
10.2 mm
|
10.06 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
BUFFER
|
INVERTER
|
Max I(ol) |
0.006 A
|
|
Number of Functions |
6
|
6
|
Number of Inputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Packing Method |
TR
|
|
Prop. Delay@Nom-Sup |
140 ns
|
|
Propagation Delay (tpd) |
140 ns
|
160 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
2.05 mm
|
2.2 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Temperature Grade |
MILITARY
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
5.275 mm
|
5.5 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MC14050BFL2 with alternatives
Compare HD14050BFP with alternatives