MC14050BFL2 vs HD14050BFP feature comparison

MC14050BFL2 onsemi

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HD14050BFP Renesas Electronics Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer ON SEMICONDUCTOR RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP16,.3 SOP,
Pin Count 16 16
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e0
Length 10.2 mm 10.06 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUFFER INVERTER
Max I(ol) 0.006 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Prop. Delay@Nom-Sup 140 ns
Propagation Delay (tpd) 140 ns 160 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 2.05 mm 2.2 mm
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.275 mm 5.5 mm
Base Number Matches 1 2

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