HD14050BFP
vs
MC14050BDG
feature comparison
| Part Life Cycle Code |
Contact Manufacturer
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
ONSEMI
|
| Part Package Code |
SOIC
|
SOIC 16 LEAD
|
| Package Description |
SOP,
|
SOIC-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| Length |
10.06 mm
|
9.9 mm
|
| Logic IC Type |
INVERTER
|
BUFFER
|
| Number of Functions |
6
|
6
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Propagation Delay (tpd) |
160 ns
|
140 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
1.75 mm
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.5 mm
|
3.9 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
751B-05
|
| ECCN Code |
|
EAR99
|
| Factory Lead Time |
|
9 Weeks, 1 Day
|
| Samacsys Manufacturer |
|
onsemi
|
| JESD-609 Code |
|
e3
|
| Load Capacitance (CL) |
|
50 pF
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOP16,.25
|
| Packing Method |
|
RAIL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
140 ns
|
| Schmitt Trigger |
|
NO
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare HD14050BFP with alternatives
Compare MC14050BDG with alternatives