MC14027BCP
vs
MC14027BCP
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
PLASTIC, DIP-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
16
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
onsemi
|
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Length |
19.175 mm
|
19.175 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
J-K FLIP-FLOP
|
J-K FLIP-FLOP
|
Max Frequency@Nom-Sup |
1500000 Hz
|
6500000 Hz
|
Number of Bits |
2
|
2
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Packing Method |
RAIL
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Propagation Delay (tpd) |
350 ns
|
350 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.44 mm
|
4.44 mm
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
7.62 mm
|
7.62 mm
|
fmax-Min |
6.5 MHz
|
1.5 MHz
|
Base Number Matches |
2
|
3
|
Max I(ol) |
|
0.00088 A
|
|
|
|
Compare MC14027BCP with alternatives
Compare MC14027BCP with alternatives