MC14027BCP
vs
MC14027BCLDS
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MOTOROLA SEMICONDUCTOR PRODUCTS
MOTOROLA SEMICONDUCTOR PRODUCTS
Package Description
DIP, DIP16,.3
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
JESD-30 Code
R-PDIP-T16
R-XDIP-T16
JESD-609 Code
e0
e0
Load Capacitance (CL)
50 pF
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Max Frequency@Nom-Sup
6500000 Hz
Max I(ol)
0.00088 A
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supplies
5/15 V
5/15 V
Qualification Status
Not Qualified
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn/Pb)
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
MASTER-SLAVE
MASTER-SLAVE
Base Number Matches
4
3