MC14027BCP vs HD14027BP feature comparison

MC14027BCP Freescale Semiconductor

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HD14027BP Renesas Electronics Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS RENESAS ELECTRONICS CORP
Package Description DIP, DIP16,.3 DIP,
Reach Compliance Code unknown compliant
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Max Frequency@Nom-Sup 6500000 Hz
Max I(ol) 0.00088 A
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies 5/15 V
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type MASTER-SLAVE POSITIVE EDGE
Base Number Matches 4 2
Part Package Code DIP
Pin Count 16
HTS Code 8542.39.00.01
Family 4000/14000/40000
Length 19.2 mm
Number of Bits 2
Output Polarity COMPLEMENTARY
Propagation Delay (tpd) 400 ns
Seated Height-Max 5.06 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Width 7.62 mm
fmax-Min 6.5 MHz

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