MC10H174M
vs
MC10H158FNG
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
EIAJ, SO-16
|
LEAD FREE, PLASTIC, LCC-20
|
Pin Count |
16
|
20
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
4 Weeks
|
Family |
10H
|
10H
|
JESD-30 Code |
R-PDSO-G16
|
S-PQCC-J20
|
JESD-609 Code |
e4
|
e3
|
Length |
10.2 mm
|
8.965 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
2
|
4
|
Number of Inputs |
4
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
20
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Equivalence Code |
SOP16,.3
|
LDCC20,.4SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Packing Method |
RAIL
|
RAIL
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Power Supply Current-Max (ICC) |
80 mA
|
53 mA
|
Prop. Delay@Nom-Sup |
3.2 ns
|
2.9 ns
|
Propagation Delay (tpd) |
2.5 ns
|
1.9 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.05 mm
|
4.57 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Width |
5.275 mm
|
8.965 mm
|
Base Number Matches |
4
|
1
|
Pbfree Code |
|
Yes
|
Manufacturer Package Code |
|
775-02
|
Output Characteristics |
|
OPEN-EMITTER
|
|
|
|
Compare MC10H174M with alternatives
Compare MC10H158FNG with alternatives