MC10H158FNG
vs
MC10174P
feature comparison
| Pbfree Code |
No
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MOTOROLA INC
|
| Part Package Code |
QLCC
|
DIP
|
| Package Description |
LEAD FREE, PLASTIC, LCC-20
|
DIP, DIP16,.3
|
| Pin Count |
20
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| Family |
10H
|
10K
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDIP-T16
|
| JESD-609 Code |
e3
|
e0
|
| Length |
8.965 mm
|
19.175 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
|
| Number of Functions |
4
|
2
|
| Number of Inputs |
2
|
4
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
75 °C
|
85 °C
|
| Operating Temperature-Min |
|
-30 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
1.9 ns
|
6.6 ns
|
| Qualification Status |
COMMERCIAL
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.44 mm
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
8.965 mm
|
7.62 mm
|
| Base Number Matches |
2
|
5
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIP16,.3
|
| Power Supply Current-Max (ICC) |
|
80 mA
|
| Prop. Delay@Nom-Sup |
|
6.6 ns
|
|
|
|
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