MC10H173FNR2
vs
MC10H186L
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
ONSEMI
|
Part Package Code |
QLCC
|
DIP
|
Package Description |
PLASTIC, LCC-20
|
CERAMIC, DIP-16
|
Pin Count |
20
|
16
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
FOUR 2:1 MUX FOLLOWED BY LATCH
|
RESET ACTIVE ONLY WHEN CLOCK IS LOW
|
Family |
10H
|
10H
|
JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Length |
8.965 mm
|
19.49 mm
|
Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
4
|
6
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC20,.4SQ
|
DIP16,.3
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Packing Method |
TR
|
|
Power Supply Current-Max (ICC) |
73 mA
|
121 mA
|
Prop. Delay@Nom-Sup |
3.7 ns
|
|
Propagation Delay (tpd) |
3.7 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
5.08 mm
|
Surface Mount |
YES
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Finish |
Tin/Lead (Sn80Pb20)
|
TIN LEAD
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
Width |
8.965 mm
|
7.62 mm
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
4 Weeks
|
Max Frequency@Nom-Sup |
|
250000000 Hz
|
fmax-Min |
|
250 MHz
|
|
|
|
Compare MC10H173FNR2 with alternatives
Compare MC10H186L with alternatives