MC10H173FNR2
vs
10H535/BFAJC
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Package Description |
QCCJ,
|
DFP, FL14,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
FOUR 2:1 MUX FOLLOWED BY LATCH
|
|
| Family |
10H
|
|
| JESD-30 Code |
S-PQCC-J20
|
R-XDFP-F14
|
| Length |
8.965 mm
|
|
| Logic IC Type |
D LATCH
|
J-K FLIP-FLOP
|
| Number of Bits |
4
|
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
20
|
14
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
QCCJ
|
DFP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Power Supply Current-Max (ICC) |
73 mA
|
75 mA
|
| Propagation Delay (tpd) |
3.7 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Form |
J BEND
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Trigger Type |
LOW LEVEL
|
MASTER-SLAVE
|
| Width |
8.965 mm
|
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Max Frequency@Nom-Sup |
|
250000000 Hz
|
| Package Equivalence Code |
|
FL14,.3
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|