MC10H173FNR2
vs
10H535M/B2AJC
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
PLASTIC, LCC-20
|
QCCN, LCC20,.35SQ
|
Pin Count |
20
|
20
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
FOUR 2:1 MUX FOLLOWED BY LATCH
|
|
Family |
10H
|
10H
|
JESD-30 Code |
S-PQCC-J20
|
S-CQCC-N20
|
JESD-609 Code |
e0
|
e0
|
Length |
8.965 mm
|
8.885 mm
|
Logic IC Type |
D LATCH
|
JBAR-KBAR FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
4
|
2
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
75 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Polarity |
TRUE
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCJ
|
QCCN
|
Package Equivalence Code |
LDCC20,.4SQ
|
LCC20,.35SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Packing Method |
TR
|
|
Power Supply Current-Max (ICC) |
73 mA
|
75 mA
|
Prop. Delay@Nom-Sup |
3.7 ns
|
|
Propagation Delay (tpd) |
3.7 ns
|
2.6 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
1.9 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn80Pb20)
|
TIN LEAD
|
Terminal Form |
J BEND
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
Width |
8.965 mm
|
8.885 mm
|
Base Number Matches |
1
|
1
|
Max Frequency@Nom-Sup |
|
250000000 Hz
|
Screening Level |
|
38535Q/M;38534H;883B
|
fmax-Min |
|
250 MHz
|
|
|
|
Compare MC10H173FNR2 with alternatives
Compare 10H535M/B2AJC with alternatives