MC10H159L
vs
10174FC
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MOTOROLA INC
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
DIP
DFP
Package Description
DIP, DIP16,.3
DFP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
10H
10K
JESD-30 Code
R-GDIP-T16
R-CDFP-F16
JESD-609 Code
e0
Length
19.495 mm
9.906 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
2
Number of Inputs
2
4
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
75 °C
75 °C
Operating Temperature-Min
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Output Polarity
INVERTED
TRUE
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
DFP
Package Equivalence Code
DIP16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Power Supply Current-Max (ICC)
58 mA
50 mA
Prop. Delay@Nom-Sup
3.2 ns
Propagation Delay (tpd)
3.2 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
1.905 mm
Surface Mount
NO
YES
Technology
ECL
ECL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL EXTENDED
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
6.731 mm
Base Number Matches
1
2
Compare MC10H159L with alternatives
Compare 10174FC with alternatives