MC10H158PG
vs
MC10158P
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ONSEMI
MOTOROLA INC
Part Package Code
DIP
Package Description
LEAD FREE, PLASTIC, DIP-16
PLASTIC, DIP-16
Pin Count
16
Manufacturer Package Code
648-08
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
10H
10K
JESD-30 Code
R-PDIP-T16
R-PDIP-T16
JESD-609 Code
e3
e0
Length
19.175 mm
19.175 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-30 °C
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP16,.3
DIP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Packing Method
RAIL
Peak Reflow Temperature (Cel)
260
Power Supply Current-Max (ICC)
53 mA
53 mA
Prop. Delay@Nom-Sup
2.9 ns
4.8 ns
Propagation Delay (tpd)
1.9 ns
4.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.44 mm
4.44 mm
Surface Mount
NO
NO
Technology
ECL
ECL
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Finish
TIN
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
5
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