MC10H158PG
vs
5962-8756601EA
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
MOTOROLA INC
|
Part Package Code |
DIP
|
DIP
|
Package Description |
LEAD FREE, PLASTIC, DIP-16
|
DIP, DIP16,.3
|
Pin Count |
16
|
16
|
Manufacturer Package Code |
648-08
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
10H
|
10H
|
JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
JESD-609 Code |
e3
|
e0
|
Length |
19.175 mm
|
19.49 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Number of Functions |
4
|
4
|
Number of Inputs |
2
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
75 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Packing Method |
RAIL
|
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
53 mA
|
53 mA
|
Prop. Delay@Nom-Sup |
2.9 ns
|
|
Propagation Delay (tpd) |
1.9 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.44 mm
|
5.08 mm
|
Surface Mount |
NO
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
7.62 mm
|
Base Number Matches |
2
|
5
|
Screening Level |
|
38535Q/M;38534H;883B
|
|
|
|
Compare MC10H158PG with alternatives
Compare 5962-8756601EA with alternatives