MC10174FNR2
vs
MC10H164P
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
QLCC
Package Description
PLASTIC, LCC-20
DIP, DIP16,.3
Pin Count
20
Reach Compliance Code
not_compliant
unknown
HTS Code
8542.39.00.01
Family
10K
JESD-30 Code
S-PQCC-J20
R-PDIP-T16
JESD-609 Code
e0
e0
Length
8.965 mm
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Moisture Sensitivity Level
1
Number of Functions
2
1
Number of Inputs
4
8
Number of Outputs
1
Number of Terminals
20
16
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-30 °C
Output Characteristics
OPEN-EMITTER
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
DIP
Package Equivalence Code
LDCC20,.4SQ
DIP16,.3
Package Shape
SQUARE
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Packing Method
TR
Peak Reflow Temperature (Cel)
235
Prop. Delay@Nom-Sup
6.6 ns
2.6 ns
Propagation Delay (tpd)
6.2 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
Surface Mount
YES
NO
Technology
ECL
ECL
Temperature Grade
OTHER
COMMERCIAL
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
8.965 mm
Base Number Matches
3
5
Power Supply Current-Max (ICC)
83 mA
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