MC10160FNR2
vs
MC10H166P
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ON SEMICONDUCTOR
|
| Package Description |
QCCJ,
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ODD PARITY GENERATOR
|
TWO OUTPUT PROVIDES: A < B; A > B AND A = B FUNCTIONS
|
| Family |
10K
|
10H
|
| JESD-30 Code |
S-PQCC-J20
|
R-PDIP-T16
|
| Length |
8.9662 mm
|
19.175 mm
|
| Logic IC Type |
PARITY GENERATOR/CHECKER
|
MAGNITUDE COMPARATOR
|
| Number of Bits |
12
|
5
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
16
|
| Operating Temperature-Max |
85 °C
|
75 °C
|
| Operating Temperature-Min |
-30 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
86 mA
|
|
| Propagation Delay (tpd) |
8 ns
|
3.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.44 mm
|
| Surface Mount |
YES
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
COMMERCIAL EXTENDED
|
| Terminal Form |
J BEND
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
8.9662 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
No
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
DIP16,.3
|
| Peak Reflow Temperature (Cel) |
|
235
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC10160FNR2 with alternatives
Compare MC10H166P with alternatives