MC10H166P
vs
MC10H166L
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ON SEMICONDUCTOR
|
| Package Description |
PLASTIC, DIP-16
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH INHIBIT; WITH A < B & A > B OUTPUTS
|
TWO OUTPUT PROVIDES: A < B; A > B AND A = B FUNCTIONS
|
| Family |
10H
|
10H
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.175 mm
|
19.49 mm
|
| Logic IC Type |
MAGNITUDE COMPARATOR
|
MAGNITUDE COMPARATOR
|
| Number of Bits |
5
|
5
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
117 mA
|
|
| Propagation Delay (tpd) |
4.1 ns
|
3.7 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
5.08 mm
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
4
|
5
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| Peak Reflow Temperature (Cel) |
|
235
|
|
|
|
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