MBM29DL323TE-90TN vs M28W320ECB70N1T feature comparison

MBM29DL323TE-90TN FUJITSU Limited

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M28W320ECB70N1T STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC STMICROELECTRONICS
Part Package Code TSOP1 TSOP
Package Description PLASTIC, TSOP1-48 12 X 20 MM, PLASTIC, TSOP-48
Pin Count 48 48
Reach Compliance Code unknown unknown
Access Time-Max 90 ns 70 ns
Alternate Memory Width 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 2 1
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature BOTTOM BOOT BLOCK
Boot Block BOTTOM
Type NOR TYPE

Compare MBM29DL323TE-90TN with alternatives

Compare M28W320ECB70N1T with alternatives