MBM27256-17Z
vs
AS27C256-17JI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
MICROSS COMPONENTS
Package Description
WDIP,
0.600 INCH, CERAMIC, DIP-28
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
170 ns
170 ns
JESD-30 Code
R-GDIP-T28
R-CDIP-T28
Length
37.275 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.84 mm
5.8928 mm
Supply Current-Max
0.05 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
2
1
Part Package Code
DIP
Pin Count
28
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Programming Voltage
12.5 V
Standby Current-Max
0.0003 A
Compare MBM27256-17Z with alternatives
Compare AS27C256-17JI with alternatives