MBM27256-17Z vs TMS27C256-1JE feature comparison

MBM27256-17Z FUJITSU Semiconductor Limited

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TMS27C256-1JE Texas Instruments

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC TEXAS INSTRUMENTS INC
Package Description WDIP, WDIP, DIP28,.6
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 170 ns 170 ns
JESD-30 Code R-GDIP-T28 R-GDIP-T28
Length 37.275 mm
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 32KX8 32KX8
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code WDIP WDIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE, WINDOW
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.84 mm 4.907 mm
Supply Current-Max 0.05 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Part Package Code DIP
Pin Count 28
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIP28,.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 13 V
Standby Current-Max 0.00025 A
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare MBM27256-17Z with alternatives

Compare TMS27C256-1JE with alternatives