MB95F222HPF-G-SNE1
vs
MC9S08LC36CLK
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
CYPRESS SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
SOP-16
|
12 X 12 MM, 1 MM HEIGHT, ROHS COMPLIANT, LQFP-80
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
3A991.A.2
|
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
F2MC-8
|
|
| Clock Frequency-Max |
32.5 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G16
|
S-PQFP-G80
|
| JESD-609 Code |
e4
|
|
| Length |
10.15 mm
|
12 mm
|
| Number of I/O Lines |
12
|
24
|
| Number of Terminals |
16
|
80
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
LFQFP
|
| Package Equivalence Code |
SOP16,.3
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
240
|
|
| ROM (words) |
4096
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
2.25 mm
|
1.6 mm
|
| Speed |
16.25 MHz
|
16 MHz
|
| Supply Current-Max |
39.5 mA
|
|
| Supply Voltage-Max |
5.5 V
|
1.8 V
|
| Supply Voltage-Min |
5 V
|
0.9 V
|
| Supply Voltage-Nom |
5 V
|
1 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Width |
5.3 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare MB95F222HPF-G-SNE1 with alternatives
Compare MC9S08LC36CLK with alternatives