MC9S08LC36CLK
vs
MC9S08QD4CPC
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
FREESCALE SEMICONDUCTOR INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFP
|
DIP
|
| Package Description |
LFQFP,
|
ROHS COMPLIANT, PLASTIC, DIP-8
|
| Pin Count |
80
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
S-PQFP-G80
|
R-PDIP-T8
|
| Length |
12 mm
|
9.779 mm
|
| Number of I/O Lines |
24
|
4
|
| Number of Terminals |
80
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.6 mm
|
5.334 mm
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Voltage-Max |
1.8 V
|
5.5 V
|
| Supply Voltage-Min |
0.9 V
|
2.7 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
12 mm
|
7.62 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
2
|
3
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
NOT SPECIFIED
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Voltage-Nom |
|
5 V
|
| Terminal Finish |
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MC9S08LC36CLK with alternatives
Compare MC9S08QD4CPC with alternatives