MB86930-40ZF-G
vs
79R4700133DP
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
FUJITSU LTD
|
INTEGRATED DEVICE TECHNOLOGY INC
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
HEAT SINK, CERAMIC, QFP-208
|
FQFP, QFP208,1.2SQ,20
|
| Pin Count |
208
|
208
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
EMULATOR SUPPORT HARDWARE; 5 PIPELINE STAGES; 40 MIPS PEAK AND 37 MIPS SUSTAINED PERFORMANCE
|
|
| Address Bus Width |
32
|
64
|
| Bit Size |
32
|
64
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
40 MHz
|
67 MHz
|
| External Data Bus Width |
32
|
64
|
| Format |
FIXED POINT
|
FLOATING POINT
|
| Integrated Cache |
NO
|
YES
|
| JESD-30 Code |
S-CQFP-G208
|
S-PQFP-G208
|
| JESD-609 Code |
e0
|
e0
|
| Length |
27.2 mm
|
28 mm
|
| Low Power Mode |
NO
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
4
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
208
|
208
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
HFQFP
|
FQFP
|
| Package Equivalence Code |
HQFP208,1.2SQ,20
|
QFP208,1.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, HEAT SINK/SLUG, FINE PITCH
|
FLATPACK, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
9.8 mm
|
4.1 mm
|
| Speed |
40 MHz
|
133 MHz
|
| Supply Current-Max |
570 mA
|
1675 mA
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
27.2 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
4
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
225
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MB86930-40ZF-G with alternatives
Compare 79R4700133DP with alternatives